XDcase TPU Heat Dissipation Shockproof Protective Case, For ASUS ROG Ally

XDcase TPU Heat Dissipation Shockproof Protective Case, For ASUS ROG Ally

$10.56

1. Made of TPU material, skin-friendly, dirt-resistant, shock-resistant and drop-proof.2. 1 to 1 real machine molding, easy to use and fit your device tightly and firmly.3. TPU material is flexible and shock-absorbing, effectively absorbing the impact of the fall and reducing body damage.4. Fits the curve of the palm, non-slip grip comfortably, not tired of playing for a long time.5. Resistant to damage caused by accidental drops and wraps your device 360 degrees.6. Attention: only the protective cover, does not include other items. Specification: General Compatible with ASUS: ROG Ally Package Weight One Package Weight 0.12kgs / 0.27lb One Package Size…

Description

1. Made of TPU material, skin-friendly, dirt-resistant, shock-resistant and drop-proof.
2. 1 to 1 real machine molding, easy to use and fit your device tightly and firmly.
3. TPU material is flexible and shock-absorbing, effectively absorbing the impact of the fall and reducing body damage.
4. Fits the curve of the palm, non-slip grip comfortably, not tired of playing for a long time.
5. Resistant to damage caused by accidental drops and wraps your device 360 degrees.
6. Attention: only the protective cover, does not include other items.

Specification:
General
Compatible with
ASUS: ROG Ally
Package Weight
One Package Weight 0.12kgs / 0.27lb
One Package Size 29cm * 12cm * 4cm / 11.42inch * 4.72inch * 1.57inch
Qty per Carton 50
Carton Weight 7.40kgs / 16.31lb
Carton Size 60cm * 30cm * 38cm / 23.62inch * 11.81inch * 14.96inch
Loading Container 20GP: 389 cartons * 50 pcs = 19450 pcs
40HQ: 905 cartons * 50 pcs = 45250 pcs

Additional information

Weight N/A
Dimensions N/A
Model

For ASUS ROG Ally

Color

Transparent, Transparent Black

Reviews

There are no reviews yet.

Be the first to review “XDcase TPU Heat Dissipation Shockproof Protective Case, For ASUS ROG Ally”

Your email address will not be published. Required fields are marked *